Matt A. Korhonen: search on Z-Library

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1

The effects of underfill on the reliability of flip chip solder joints

Peng Su, Sven Rzepka, Matt Korhonen, C. Y. Li

Journal:

Journal of Electronic Materials

Year:

1999

Language:

english

File:

PDF, 505 KB

english, 1999

2

Effect of CU and SI in Aluminum on Stress Change and on TiAl3 Formation in Al Alloy/TI Bilayer Films During Annealing

Brown, Dirk D., Besser, Paul R., Sanchez, John E., Korhonen, Matt A., Li, Che-Yu

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 397 KB

english, 1994

3

FEM Analysis of Thermal Stresses in Advanced Electronic Packages

Rzepka, Sven, Korhonen, Matt A., Li, Che-Yu, Meusel, Ekkehard

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 3.24 MB

english, 1998

4

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

Su, Peng, Zhou, Chen, Rzepka, Sven, Korhonen, Matt, Li, Che-Yu

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 281 KB

english, 1998

5

AIP Conference Proceedings [AIP The fifth international workshop on stress induced phenomena in metallization - Stuttgart (Germany) (23-25 June 1999)] - A finite element study of thermal stress in copper interconnect

Su, Peng, Rzepka, Sven, Korhonen, Matt A., Li, Che-Yu

Year:

1999

File:

PDF, 556 KB

1999

6

Gene–Environment Interplay in Physical, Psychological, and Cognitive Domains in Mid to Late Adulthood: IsAPOEa Variability Gene?

Reynolds, Chandra A., Gatz, Margaret, Christensen, Kaare, Christiansen, Lene, Dahl Aslan, Anna K., Kaprio, Jaakko, Korhonen, Tellervo, Kremen, William S., Krueger, Robert, McGue, Matt, Neiderhiser, Je

Journal:

Behavior Genetics

Year:

2016

Language:

english

File:

PDF, 752 KB

english, 2016

7

Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

Tia-Marje K. Korhonen, Lawrence P. Lehman, Matt A. Korhonen, Donald W. Henderson

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 339 KB

english, 2007

8

AIP Conference Proceedings [AIP The fifth international workshop on stress induced phenomena in metallization - Stuttgart (Germany) (23-25 June 1999)] - A finite element study of thermal stress in copper interconnect

Su, Peng, Rzepka, Sven, Korhonen, Matt A., Li, Che-Yu

Year:

1999

Language:

english

File:

PDF, 556 KB

english, 1999

9

Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines

Rzepka, Sven, Korhonen, Matt A., Weber, Eicke R., Li, Che-Yu

Journal:

MRS Proceedings

Year:

1997

Language:

english

File:

PDF, 3.55 MB

english, 1997

10

Multi-SimLex: A Large-Scale Evaluation of Multilingual and Cross-Lingual Lexical Semantic Similarity

VuliÄ, Ivan, Ponti, Edoardo Maria, Leviant, Ira, Majewska, Olga, Malone, Matt, Reichart, Roi, Baker, Simon, Petti, Ulla, Wing, Kelly, Bar, Eden, Poibeau, Thierry, Korhonen, Anna

Journal:

Computational Linguistics

Year:

2020

File:

PDF, 716 KB

2020

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